Kaijo Bonding Technology
Ultrasonic wire bonding is one of the most flexible techniques for making electrical connections in numerous fields. Since this technology can be performed instantly without melting metals, wire bonders using ultrasound are used particularly in the semiconductor manufacturing process of interconnecting electrodes and lead frames of integrated circuits with metal wires.
Kaijo continues to take on the challenge of joining materials other than metals, as well as joining dissimilar metals.