Model Based Infrared Reflectometry

List 5 product

IR-2100

Extended wavelength model-based infrared reflectometry with high throughput, low COO, non-contact, non-destructive measurements of thickness and uniformity of dielectric layers and etched structures used in integrated circuit manufacturing. The unique technology and analysis capability of the IR product line, simplifies system calibration requirements and removes the effect of substrate variations for key layer measurements.

IR-2200

Extended wavelength model-based infrared reflectometry with high throughput, low COO, non-contact, non-destructive measurements of thickness and uniformity of dielectric layers and etched structures used in integrated circuit manufacturing. The unique technology and analysis capability of the IR product line, simplifies system calibration requirements and removes the effect of substrate variations for key layer measurements.

IR-2500

Extended wavelength model-based infrared reflectometry with high throughput, low COO, non-contact, non-destructive measurements of thickness and uniformity of dielectric layers and etched structures used in integrated circuit manufacturing. The unique technology and analysis capability of the IR product line, simplifies system calibration requirements and removes the effect of substrate variations for key layer measurements.

IR-3200

Extended wavelength model-based infrared reflectometry with high throughput, low COO, non-contact, non-destructive measurements of thickness and uniformity of dielectric layers and etched structures used in integrated circuit manufacturing. The unique technology and analysis capability of the IR product line, simplifies system calibration requirements and removes the effect of substrate variations for key layer measurements.

SEIR-3000

The SEIR-3000 uses proprietary model-based infrared reflectometry (MBIR) and Spectroscopic Ellipsome-try (SE) technology to deliver high throughput, low COO, non-contact, non-destructive measurements of the 3D geometry structures and uniformity of doped epitaxial layers and films used in integrated circuit manufacturing. The small spotsize makes the tool suitable for measurements of scribeline test structures. The unique hybrid SE-IR technology and analysis capability of the SEIR-3000 enables measurement capability of challenging structures and film stacks.