H47 Copper Ball Bonding Kit
| The copper ball bonding Kit enables the TPT wire bonder to do Cu ball bonds by using a gas flow during flame off to prevent oxidization of the ball. |
H50 Spotlight Targeting System
The TPT Spotlight targeting system allows precise aiming with a small laser spot.
H51 Manual Z-Controller
The TPT manual Z-Controller allows you to operate your bondhead manually. The Bond is being made automatically as soon as the needle hits the substrate. Especially when it comes to complex loop shapes the manual Z-Controller is of great help. This addon makes height adjustments unnecessary.
H52 Dynamic Search
The TPT Dynamic Search box offers 3 features:
- Dynamic Search adjustment
- Dynamic bond length adjustment
- Stitch function
H53 Pull Tester
The H53 Pull tester is a simple solution to test your bonds for bond strength.
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H80 Pick & Place Kit
H80 Pick & Place Kit
The TPT Pick & Place kit offers:
- Easy change from wire bonding to die bonding
- 6 to 1 fine ratio manipulator
- programmable force 10cN up to 150cN
- programmable time from up to 10sec
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