Pull Testers

List 7 product

Sigma

Advanced Bond Tester

Proven Sigma Performance

Sigma is the most advanced bond tester. It comes with game-changing automation capabilities and high specifications in:

  • Sensor accuracy and resolution
  • Large X stage
  • Superior axis speed
  • Cameras and illumination
  • Future proof and modular design

Sigma EFEM

Equipment Front End Module

Chosen by the world’s top 4 semiconductor packaging houses

Integration transforms the bond tester into a fully automated system. We offer various types of EFEM (Equipment Front End Module) wafer handlers, to combine with a Sigma W12 for operator-free bond testing.

  • Wafers or at wafer level 2” – 12” (up to 300 mm)
  • Precise testing and Cold Bump Pull (CBP) testing
  • Large X/Y stages X: 600mm, Y: 370 mm
  • Force range from 1gf – 10 kgf
  • Bump pitch down to 20 µm

Sigma HF/L

High Force, Large Area

World’s most powerful bond testers

  • For high force and large area
  • Typically for IGBT, power modules and batteries up to 1000 kgf
  • High axis speed
  • Deep access up to 80 mm
  • SEMI S2 safety cabinet with visual feedback
  • Flexible positioning of multiple work holders

Sigma Lite

Low Cost Bond Tester

Proven Sigma Performance

Sigma lite is a low cost of ownership bond tester that grows with your company. It gives you a low-cost entry point without sacrificing performance to meet future demands.

 

For more advanced and automatic bond testing, the Sigma Lite is upgradable to a full Sigma bondtester, which comes with higher specifications in:

  • Sensor accuracy and resolution
  • Larger X stage
  • Superior axis speed
  • Cameras and illumination
  • Dual monitor support

Sigma MAG

Magazine Handler

Magazine handler
for automated lead frame testing

The Sigma MAG comes with an independent lead frame (un)loader for hands-free bond testing. The magazine handler is compatible with OHT and AGV and allows top and front-loading of multiple types of:

  • Lead frames
  • Cassettes
  • Magazines
  • PCBs
  • Flex
  • Boat carriers

Sigma W12

Wafer Bond Tester

Bond tester for wafers 2 – 12 inch

  • Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)
  • Precise testing and Cold Bump Pull (CBP) testing
  • Large X/Y stages X: 600mm, Y: 370 mm
  • Force range from 1gf – 10 kgf
  • Bump pitch down to 20 µm

Sigma W8

Wafer Bond Tester

Bond tester for wafers 4 – 8 inch

  • Bondtester for wafers or at wafer level 4” – 8” (up to 200 mm)
  • Fully automatic wafer bond tester
  • X/Y stages X: 370 mm, Y: 370 mm
  • Force range from 1 gf – 10 kgf
  • Bump pitch down to 50 µm