FB-x26BUMP1
Fully Automatic Thermo-Sonic Stud Bump Bonder
The FB-x26BUMP1 is designed for high-speed bump bonding of silicon wafers. It provides thermo-sonic welding of balls from gold, copper or silver wires.
FB-x26BUMP2
Fully Automatic Stud Bump Bonder
The Kaijo FB-x26BUMP2 is designed for high-speed bump bonding of silicon wafers up to 8 inches in diameter. It provides thermo-sonic welding of balls from gold, copper or silver wires.
FB-x26BUMP3
Fully Automatic Stud Bump Bonder
The Kaijo FB-x26BUMP3 is designed for high-speed bump bonding of silicon wafers up to 8 inches in diameter. It provides thermo-sonic welding of balls from gold, copper or silver wires and offers a two-stage mechanism for a significant increase of productivity.