En-Vision (Enhanced Vision) provides non-contact measurements of buried defects, such as dislocations, oxygen precipitates or stacking faults. These are not visible using optical inspection. By bringing buried defect control inside the IC Fabs and covering a wide range of density and applications, En-Vision dramatically enhances buried defect detection by more than a 100× compare to traditional techniques (X-TEM / SECCO etching).

En-Vision offers a high dynamic range in both defect size (15 nm to sub-micron) and density (E6 – E 10 /cm3).