FAaST 310/210 SPV

The FAaST 310/210 SPV systems provide fast, full wafer contamination imaging in a design suitable for R&D and low-volume manufacturing environments.

Description

Features and System specifications:

  • Manual wafer loading, including cassette placement station and vacuum wand
  • Automatic full wafer FAST mapping of diffusion length, Iron, and Other Recombination Centers (Nr)
  • FAaST software package, including measurement, recipe writing and data viewing applications
  • Configurable for 50 mm to 300 mm wafers, with options available for multiple wafer sizes
  • Step down power transformer with flexible compatibility
  • Additional available options include: Automatic data upload and/or data export, Seismic brackets