Semilab’s new generation sheet resistance measurement tools combine four-point probe (4PP) with non-contact measurement techniques in a variety of platforms from the cost-effective, low automation platform (WT) to full SEMI standard compliant platforms (RT). In addition to the more conventional 4PP, non-contact measurement can be applied to BEOL (metal layers thickness) using EDDY or to FEOL (implant monitoring) using JPV.


Features and System specifications:

  • Inspected area: Full sheet wafers
  • Probes: 4PP (FEOL & BEOL) , EDDY (BEOL) , JPV (FEOL)
  • 1-4 permanent 4PP heads for different ranges & applications, Lower CoO