Description
Features and System specifications:
- Meas. technique: capacitive thickness and eddy current resistivity
- Sample size: 125 to 156 mm (210 mm option)
- Distance between top and bottom sensors: 2 mm (4mm option for WLT)
- Thickness range: 100 to 500 µm
- Resistivity range: 0.3-15 Ωcm
- Wafer vertical position tolerance: <300 μm
- Sample support: on belt
- Calibration: by wafers verified with mechanical gauge and four point probe
Options:
- Measurement module (incl. 1-5 sheet resistance measurement heads)
- Industrial PC (Windows operation system) and peripherals
- P/N conductivity type tester
- Temperature sensor
- Warp & Bow calculation
- Wafer presence sensor (WMT only)
Wide variety of available interfaces to automation and MES:
- 24V optically isolated I/O, Ethernet interface
- Profibus
- OPC DA
- TCP/IP protocol, content can be XML or ASCII
- SQL database
- SECS/GEM