Pick & PlacePick Microchip from Die-Carrier and place it to your surface
Epoxy DispensingSimple and exact handling
Epoxy StampingFast and precise stamping process
Rotation Bondheadfor Quick Change between tools
InspectionVisual inspection of microassembly for example from soldering, bonding or flip chip
True vertical Z movementMotorized Z-axis with 90° linear movement
Full HD CameraOverlook no detail, thanks high resolution camera with optical zoom
X-Y Micrometer screwsExact placement from Die, stamp or dispenser
Camera anglesFree changeable camera angle with optical zoom for a good and easy verification
Angle alignmentMicrochip alignment thru the rotable work plate
Auto Vacuum Pumpintegrated vacuum pump turns on automatically at Pick & Place.
optional heater stageUp to 450 ° C heat, with programmable heating cycles
