Description

HB75 Semiautomatic Die Bonder

Pick & Place

Pick Microchip from Die-Carrier and place it to your surface

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Epoxy Dispensing

Simple and exact handling
Epoxy Stamping

Fast and precise stamping process
Rotation Bondhead

for Quick Change between tools
True vertical Z movement

Motorized Z-axis with 90° linear movement
Angle alignment

Microchip alignment thru the rotable work plate
Auto Vacuum Pump

Integrated vacuum pump turns on automatically at Pick & Place.
Optional heater stage

Up to 450 ° C heat, with programmable heating cycles