FAaST 310/210 SPV
(EN) The FAaST 310/210 SPV systems provide fast, full wafer contamination imaging in a design suitable for R&D and low-volume manufacturing environments.
FAaST 330/230 DSPV
(EN) The FAaST 330/230 DSPV systems are designed to provide world-leading, non-contact fast in-line monitoring of heavy metal contamination, including sub 108 atoms/cm-3 Fe detection, with automated wafer handling that is suitable for the medium to high-volume manufacturing environment.
FAaST 350 DSPV
(EN) The FAaST 350 DSPV system is the flagship platform designed to provide world-leading, non-contact fast monitoring of heavy metal contamination, including sub 108 atoms/cm-3 Fe detection, with automated wafer handling from dual FOUP loadport loading stations fully capable of supporting the most demanding high-volume manufacturing environment.
FB-e20N
Tam Otomatik Yüksek Hızlı Tel Bağlayıcı
FB-e20N, Kaijo Ball Bonder ailesinin en yeni neslinin bir parçasıdır. Ayrı bileşenler, LED’ler ve altın, bakır veya argentum alaşımlı tel kullanan küçük bileşen paketleri dahil olmak üzere çeşitli uygulamaların tüm tel bağlama gereksinimlerini karşılamak üzere tasarlanmıştır.