The A4P-Series Wafer Resistivity Mappers use proven industry standards to provide fast, accurate and reliable measurements of sample resistivity distribution. MicroXact’s four-point probes measure the average resistance of semiconductor wafers of layers by passing current through the outside points of a four-point probe and measuring the voltage across the inside points. The value of resistivity, the property of the material giving it electrical resistance, can then be found by multiplying sheet resistance by the thickness of a film.
Offered as a 100mm, 150mm, 200mm, or 300mm system, the A4P four-point probe is designed to be maintenance-free and very easy to use. A variety of options are available for this system, including wide-range thermal testing, custom chucks for non-standard materials and 4-point probes customized for nearly any application.
Resistivity Measurement Automation Software
The A4P-200-PLUS automation software permits semi-automated or fully automated testing with the resistivity mapping system. The Interface is designed to be simple yet powerful, allowing users to easily set up an automated testing procedure for nearly any kind of wafer structure. The LabView-based software is logically structured and allows for easy integration of the customer’s own test and measurement equipment. The software can be installed on any PC with Windows XP or higher operating system.
The LCS-4000 Probe Station with Integrated Laser Cutting System gives the user maximum flexibility in semiconductor diagnostic cutting, failure analysis, trimming, marking and topside layer removal. All of these functions can be performed on a microscopic level, all on this one system, which provides a high level of performance that is remarkably easy to use.
The integrated laser cutting system can be used to alter conductors on integrated circuits by laser ablating contact leads, sacrificial layers and other materials without damage to the devise internals. This laser trimming process allows for selective layer removal, such as topside layer removal, and can aid in semiconductor failure analysis or for fine tuning device characteristics, such as resistance, capacitance or RF properties. MicroXact’s laser cutting system is also capable of isolating faulty components by cutting the metal lines that connect the faulty component to the rest of the circuit. Pre-built logic includes automated identification of faulty devices on the wafer and erasing these devices from the wafer completely via ablation.
The LCS-4000 is offered as a motorized, semi-automated or fully-automated configuration system and can easily be configured for a wide range of applications with a variety of design options and accessories available.
The SPS-1000, SPS-2000, and SPS-2200 systems are MicroXact’s premier manual probe stations designed to be flexible and easy to use. The high level of performance and affordability of these manual probe systems put them in a class of their own.
With up to 200mm wafer capabilities, DC or RF probes and optional thermal chuck, and a variety of shielding options, our probe stations can be used for the wide range of applications, such as failure analysis, reliability testing, IV/CV testing, low current testing and microwave and RF characterization to name a few.
IV, CV and low current testing with MicroXact’s manual probe stations provide the precise and accurate measurements needed for characterization of semiconductor devices. Wafer-level capacitance and low current testing on dies has never been easier due to the variety of options available and the flexibility of MicroXact’s manual probe stations.
The automated systems are driven by MicroXact’s XactTest™ probe station software. The Interface is designed to be simple and convenient, allowing users to easily set up an automated testing procedure for nearly any kind of device. The LabView-based XactTest software solution is logically structured and allows for probe station control and easy integration of the customer’s own test and measurement equipment either within the framework of XactTest™ software or using its extensive set of SCPI commands. For owners of Tektronix equipment and Keithley Automated Characterization Suite (ACS) Software, the driver for XactTest™ software is available.
The SPS 2600, SPS 2800, and SPS 12000 Series systems are MicroXact’s semi-automated probe stations designed to be flexible and easy to use when performing high productivity device characterization, wafer level reliability testing and failure analysis. These semi-automatic probe station systems are designed to support manual and semi-automatic probing of up to 200mm wafers.
As semiconductors become smaller and more complex, it has become necessary to more closely monitor and control production, especially further upstream in the process. Wafer level reliability testing performed with MicroXact’s semi-automatic probe station gathers data through series of stress tests to identify irregularities that could affect the long-term reliability of the device. Although not always needed, further and extensive failure analysis can be performed after the wafer level reliability testing.
These semi-automatic probe station systems are built on a heavy-duty, versatile platform capable of being configured to handle a wide range of probing applications. With a variety of options available, including heated/cooled wafer chucks, standard or digital microscopes, and programmable stage indexing, MicroXact’s semi-automated probe stations offer a cost-effective and easy-to-use solution for all your high productivity device characterization and wafer level reliability testing needs. Three options (standard, high-precision, and high-speed) are available for these semi-automatic probe stations