Description
Features and System specifications:
- Wafer size: up to 300 mm with bare or dielectric coated surface
- Wafer handling: manual or Semilab-made indexer
- Loading options:
- 100-200 mm cassette indexer
- 300 mm 13 slot cassette indexer, including open cassettes for 100-300 mm wafers
- 300 mm 25 slot cassette indexer, including FOUP, FOSB, and open cassettes for 100-300 mm wafers
- Light sources: semiconductor lasers (SPV head with 4 or optional 8 lasers)
- Available wavelengths: 1015 nm – 660 nm
- Full mapping with 2, 4, 8 and 16 mm raster
- Point measurements at predefined points
- Sample resistivity: down to 0.01 Ωcm
- Optional bias light:
- High intensity IR LED
- 30 W halogen lamp
- Automatic Iron-Boron Dissociation Unit – for Iron concentration
- Specific measurement performance at specific, programmable locations
Each system can be configured based on the user’s requirements by adding measurement capabilities and automation capabilities described below.
Measurement capabilities:
- µ-PCD for measuring carrier lifetime
- SPV for measuring diffusion length
- VQ for oxide monitoring
- JPV for measuring ion implants
- Eddy current measurement of sheet resistance
