Description
Features and System specifications:
- Automatic robotic wafer handling
- Dual FOUP loadport; optional configuration with single loadport or including Versaport
- Automatic full wafer FAST mapping of diffusion length, Iron, and Other Recombination Centers (Nr)
- Option for advanced digital SPV functions, including Backsurface Recombination (Sb), Steady State Diffusion Length (L0), and Copper measurements
- FAaST software package, including measurement, recipe writing and data viewing applications
- Default configuration for 300 mm wafers with option for 200 mm / 300 mm bridge configuration
- Line conditioner with flexible compatibility
- Compatible for configuration with other Semilab SDI FAaST tool measurement technologies
- Additional available options include: Minienvironment, wafer edge-grip handling, wafer flipper for automatic backsurface measurement, 300 mm Semi-compliant automation, Seismic brackets, wafer OCR, RFID, cassette barcode reader
