Sigma
Advanced Bond Tester
Proven Sigma Performance
Sigma is the most advanced bond tester. It comes with game-changing automation capabilities and high specifications in:
- Sensor accuracy and resolution
- Large X stage
- Superior axis speed
- Cameras and illumination
- Future proof and modular design
Sigma EFEM
Ön Uç Modülü Ekipmanı
Dünyanın en iyi 4 yarı iletken paketleme firması tarafından tercih edildi
Entegrasyon, bond test cihazını tam otomatik bir sisteme dönüştürür. Operatörsüz bond testi için Sigma W12 ile birleştirmek üzere çeşitli EFEM (Ön Uç Modülü Ekipmanı) wafer işleyicileri sunuyoruz.
- 2” – 12” boyutlarında Waferlar (300 mm’ye kadar)
- Hassas testler ve Cold Bump Pull (CBP) testi
- Geniş X/Y kademeleri X: 600 mm, Y: 370 mm
- 1gf – 10 kgf arası kuvvet aralığı
- 20 µm’ye kadar bump aralığı
Sigma HF/L
High Force, Large Area
World’s most powerful bond testers
- For high force and large area
- Typically for IGBT, power modules and batteries up to 1000 kgf
- High axis speed
- Deep access up to 80 mm
- SEMI S2 safety cabinet with visual feedback
- Flexible positioning of multiple work holders
Sigma Lite
Low Cost Bond Tester
Proven Sigma Performance
Sigma lite is a low cost of ownership bond tester that grows with your company. It gives you a low-cost entry point without sacrificing performance to meet future demands.
For more advanced and automatic bond testing, the Sigma Lite is upgradable to a full Sigma bondtester, which comes with higher specifications in:
- Sensor accuracy and resolution
- Larger X stage
- Superior axis speed
- Cameras and illumination
- Dual monitor support
Sigma MAG
Magazine Handler
Magazine handler for automated lead frame testing
The Sigma MAG comes with an independent lead frame (un)loader for hands-free bond testing. The magazine handler is compatible with OHT and AGV and allows top and front-loading of multiple types of:
- Lead frames
- Cassettes
- Magazines
- PCBs
- Flex
- Boat carriers
Sigma W12
Wafer Bond Tester
Bond tester for wafers 2 – 12 inch
- Bondtester for wafers or at wafer level 2” – 12” (up to 300 mm)
- Precise testing and Cold Bump Pull (CBP) testing
- Large X/Y stages X: 600mm, Y: 370 mm
- Force range from 1gf – 10 kgf
- Bump pitch down to 20 µm
Sigma W8
Wafer Bond Tester
Bond tester for wafers 4 – 8 inch
- Bondtester for wafers or at wafer level 4” – 8” (up to 200 mm)
- Fully automatic wafer bond tester
- X/Y stages X: 370 mm, Y: 370 mm
- Force range from 1 gf – 10 kgf
- Bump pitch down to 50 µm