HB05 Manual Wire Bonder
HB05 is an ideal Benchtop Wire Bonder for laboratories and R&D.
You can perform your bonding operations in Wedge/Ball or Wedge/Wedge bonding mode with a single Bonding Head. Only the bonding tip change is sufficient.
You can easily set your parameters with the TFT Screen and use it quickly.
You can customize it according to your needs with rich kit options and increase performance and efficiency.
