HB10 Wire Bonder with Automatic Z-Axis

HB10 Wire Bonder with motorized Z-Axis

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Description

HB10 Wire Bonder with motorized Z-Axis

  • Gold, aluminum, silver & copper wireWire sizes from 17µm to 75µm Ribbon sizes up to 25×250µm

  • Wedge, ball & ribbon bondingEasy to switch between different bonding modes

  • 6.5″ Touch Panel6.5″ Touch Panel provides easy control, intuitive

  • Automatic bond height adjustmentZ-axis sensor identifies touch down & sets height parameters

  • Storage of 100 parametersStorage & access of up to 100 parameter sets

  • Deep & wide bond accessAmple work space due to special bond head design

  • Motorised Wire ClampPrecise tail length control

  • Motorised Wire SpoolFor consistent looping

  • Extension Kit compatibilityPick & Place, Pull Tester, Video Targeting and Copper Ball Bonding