HB10 Wire Bonder with Automatic Z-Axis

Description

HB10 Wire Bonder with motorized Z-Axis

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  Gold, aluminum, silver & copper wireWire sizes from 17µm to 75µm Ribbon sizes up to 25×250µm

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  Wedge, ball & ribbon bondingEasy to switch between different bonding modes

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  6.5″ Touch Panel6.5″ Touch Panel provides easy control, intuitive

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  Automatic bond height adjustmentZ-axis sensor identifies touch down & sets height parameters

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  Storage of 100 parametersStorage & access of up to 100 parameter sets

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  Deep & wide bond accessAmple work space due to special bond head design

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  Motorised Wire ClampPrecise tail length control

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  Motorised Wire SpoolFor consistent looping

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  Extension Kit compatibilityPick & Place, Pull Tester, Video Targeting and Copper Ball Bonding