HB100 Automatic Wire Bonder

HB100 Automatic Wire Bonder

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Description

HB100 Automatic Wire Bonder

  • Automatic Wire BonderMotorized Z-X-Y Axis & Bondhead Rotation

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  • Gold, aluminium, silver & copper wireWire sizes from 17µm to 75µm Ribbon sizes up to 25×250µm

  • 21″ Touch ScreenTouch Screen provides easy and quick control

  • Wedge, Ball & Ribbon bondingOne Bondhead. Easy to switch between different bonding modes

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  • Simple Loop ProgrammingCreate individual loop profiles

  • Deep & Wide Bond AccessAmple work space due to special bridge design