Description

HB30 Heavy Wire Bonder

Aluminium & copper wedge bonding

Wire sizes from 100µm to 500µm Ribbon sizes up to 300×2000µm
Repeatable Loop Profiles

Motorised axis allows precise loop repetition
6.5″ Touch Panel

6.5″ Touch Panel provides easy control
Automatic bond height adjustment

Z-axis sensor identifies touch down & sets height parameters
Simple Loop Programming

Create individual loop profiles consisting of up to 10 steps
Storage of 100 parameters

Storage & access of up to 100 parameter
Deep & Wide Bond Access

Ample work space due to special bond head design
High precision cutting sequence

Specific wire cutting parameters prevent substrate injury
Vacuum Stage Fixation

Optional function for high power applications
Extension Kit compatibility

Pick & Place and Video Targeting