Showing 73–84 of 1297 results

FPT

FPT can be equipped with:

  • Spectroscopic ellipsometry
  • Spectroscopic reflectometry
  • Imaging Spectroscopic reflectometry
  • Line mura detection – Chip quality
  • Microwave Photoconductive Response – Chip Quality
  • Four point probe & six point probe
  • Contact angle measurement
  • Raman crystallinity

Optical thickness and refractive index of multilayered oxide and semiconductor structures can be determined by spectroscopic ellipsometery at different process steps. The quality of the ELA process can also be monitored by measuring crystallinity, u-PCR and line mura density. Contact angle, stress and resistivity measurements are also available.

The hardware and software are fully controlled by SEMILAB from the design to the integrated software communication with the fab.

FPT

FPT can be equipped with:

  • Spectroscopic ellipsometry
  • Spectroscopic reflectometry
  • Imaging Spectroscopic reflectometry
  • Line mura detection – Chip quality
  • Microwave Photoconductive Response – Chip Quality
  • Four point probe & six point probe
  • Contact angle measurement
  • Raman crystallinity

Optical thickness and refractive index of multilayered oxide and semiconductor structures can be determined by spectroscopic ellipsometery at different process steps. The quality of the ELA process can also be monitored by measuring crystallinity, u-PCR and line mura density. Contact angle, stress and resistivity measurements are also available.

The hardware and software are fully controlled by SEMILAB from the design to the integrated software communication with the fab.

FPT

FPT can be equipped with:

  • Spectroscopic ellipsometry
  • Spectroscopic reflectometry
  • Imaging Spectroscopic reflectometry
  • Line mura detection – Chip quality
  • Microwave Photoconductive Response – Chip Quality
  • Four point probe & six point probe
  • Contact angle measurement
  • Raman crystallinity

Optical thickness and refractive index of multilayered oxide and semiconductor structures can be determined by spectroscopic ellipsometery at different process steps. The quality of the ELA process can also be monitored by measuring crystallinity, u-PCR and line mura density. Contact angle, stress and resistivity measurements are also available.

The hardware and software are fully controlled by SEMILAB from the design to the integrated software communication with the fab.

Gamma Analysis Software GammaPRO

DESCRIPTION

GammaPRO provides all the tools necessary for separate peak analysis, namely:

  • energy calibration;
  • direct peak search in spectrum and peak search considering the radionuclides and their peak energies specified in the library;
  • peak and multiplet fit by Gaussian and other functions;
  • automatic identification of peaks;
  • considering count sample density as a calculation parameter;considering background as a calculation parameter;
  • calculation of efficiency curves (efficiency calibration), FWHM calibration, peak shape calibration.

The matrix method enables automatic calculation of activity of a sample provided its radionuclide composition is known. The method is used for routine measurements of food, building materials, water and other substances subject for permanent radiological control.
The superposition method is mainly used for control of correctness of activity calculations in case of hard-to-analyse (multiple peak) low-resolution spectra (acquired by scintillation detectors). Such a tool enables visual estimate of the degree of similarity between an acquired and calculated spectrum. Additionally, calculation data can be adjusted until the spectra completely coincide.
The Software features an integrated system for report generation which provides automatic creation of measurement results. The settings for report generation can be adjusted by user.

Igloo

This is the smallest SPM

Igloo

The smallest of the SPMs

Igloo

This is the smallest SPM

Igloo

This is the smallest SPM

inSE-1000

The new in situ thickness measurement tool, inSE-1000 provides instant access to layer thicknesses and optical properties through ellipsometric specra analysis during layer deposition processes in vacuum chambers and load locks.