FAaST 310/210 SPV
The FAaST 310/210 SPV systems provide fast, full wafer contamination imaging in a design suitable for R&D and low-volume manufacturing environments.
FAaST 330/230 DSPV
The FAaST 330/230 DSPV systems are designed to provide world-leading, non-contact fast in-line monitoring of heavy metal contamination, including sub 108 atoms/cm-3 Fe detection, with automated wafer handling that is suitable for the medium to high-volume manufacturing environment.
FAaST 350 DSPV
The FAaST 350 DSPV system is the flagship platform designed to provide world-leading, non-contact fast monitoring of heavy metal contamination, including sub 108 atoms/cm-3 Fe detection, with automated wafer handling from dual FOUP loadport loading stations fully capable of supporting the most demanding high-volume manufacturing environment.
FB-e20N
Fully Automatic High-Speed Wire Bonder
The FB-e20N is part of the latest generation of Kaijo ball bonder innovations. It is designed to meet all wire bonding requirements for a variety of applications including discrete components, LEDs and small component packages using either gold, copper or argentum alloy wire.