Description
HB05 Manual Wire Bonder
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Gold, aluminum, silver & copper wire
Wire sizes from 17µm to 75µm Ribbon sizes up to 25×250µm
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Wedge, ball & ribbon bonding
Easy to switch between bonding modes
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Compact design & intuitive control
The bonder’s practical design ensures smooth and easy use
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4″ TFT display & push dial
Fast and easy control of all bonding parameters
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Storage of 20 parameters
Easy setting recall for working on different applications
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Deep & wide access
Ample work space due to special bond head design
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Motorised Wire Clamp
Precise tail length control
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Extension Kit compatibility
Pick & Place, Pull Tester, Video Targeting and Copper Ball Bonding
